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Chemist with expertise in product development and research, commercial strategy development and customer relationship management in advanced technologies.
Strong leadership, well-respected people management.

1982 Graduated from Kyoto University Factory of Engineering
1982 - 1999 Nagase-Ciba Ltd. and 2000 - 2004 Nagase ChemteX Corp. Hyogo Japan
Technical development and research of formulated epoxy for electronic and electric encapsulation
and UV curable product for electronics sealant for world wide customers.
Successfully developed following products,
LMC(Liquid Molding Compound) for FOWL, Glob Top, Underfill and Non Conductive Paste for semiconductor industry,
UV curable products for CCD, CMOS and OLED industories, encapsulants for power IC, encapsulants and adhesive for car electronics.
Started development of LMC(Liquid Molding Compound) for FOWLP(Fan Out Wafer Level Package) since 2001.
1985 - 1986 Nagase California Office in Sunnyvale CA USA and devoted epoxy products marketing in US.
1990 - trainee of new product at Ciba-Geigy Basel Switzland
1995 - manager of one labo
1999 - manager of two labos

2005 - 2006 Nagase & Co. Ltd. Tokyo Japan
Nagase is an exclusive sales company of Nagase ChemteX products.
Technical support of epoxy and UV curable products.
Support marketing in promotion of exsiting and newly developed products.

2007 - 2014 Nagase ChemteX Corp.
2007 - Division manager of technical development of formulated epoxy for electronics and electronics.
2009 - Director of formulated epoxy and chemical for LCD(Liquid Crystal Display) and Semiconductor divisions.
Director of NCW(Nagase ChemteX Wuxi Corporate, China) and NFCS(Nagase FineChem Singapore Pte., Singapore) and EMS(Engineered Materials Systems Inc., Ohio US)
Successfully introduced LMC for FOWL applications and marged EMS.
2014 - Corporate marketing division

2015 - 2016 Nagase FineChemical Singapore Pte. Singapore
Managing Director and successfully sold the company to the third party.