海外経験豊富(US16年駐在)

エキスパート

氏名:開示前


Mike Tanahashi is currently Manager of Development Planning Dept., Research and Development Laboratory at Taiyo Yuden. He has over 30 years of experience with Taiyo Yuden, one of the largest passive component manufacturers worldwide. He has spent over 16 years in the US operation including managing Western Regional sales territory as a strategic planning manager. Additionally, he served as a Vice President of the R&D arm of Taiyo Yuden Japan when working in the Silicon Valley office, where he worked on research and business development in next generation wireless technologies industry. He is well seasoned professional especially in wireless field as he has an extensive knowledge of wireless technologies as well as market trend and was heavily involved in the standardization activities in the IEEE802 organization. Since after returning to Japan HQ back in 2006, he has been heavily involved in the technical marketing for not only wireless technologies but also in the broader market segmentation and applications including Smartphone as he served as a leader for company-wide Smartphone project. He is currently a delegate for GTI (Global TD-LTE Initiative) from Taiyo Yuden and directly involved in several on-going 5G eMBB related projects within the organization. He also has deep understanding of MLCC (Multilayer Ceramic Capacitors) in terms of both technology and market trend.

(Key word: 5G, 6G, MLCC, RF, Front-end, WiFi, WLAN, WPAN, Connectivity, UWB, Cellular, Wireless technologies, PA, Filter, Duplexer, SAW, LTCC, BAW, FBAR, Smartphone, PC, Inductor, Module)

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氏名:開示前

Mike Tanahashi is currently Manager of Development Planning Dept., Research and Development Laboratory at Taiyo Yuden. He has over 30 years of experience with Taiyo Yuden, one of the largest passive component manufacturers worldwide. He has spent over 16 years in the US operation including managing Western Regional sales territory as a strategic planning manager. Additionally, he served as a Vice President of the R&D arm of Taiyo Yuden Japan when working in the Silicon Valley office, where he worked on research and business development in next generation wireless technologies industry. He is well seasoned professional especially in wireless field as he has an extensive knowledge of wireless technologies as well as market trend and was heavily involved in the standardization activities in the IEEE802 organization. Since after returning to Japan HQ back in 2006, he has been heavily involved in the technical marketing for not only wireless technologies but also in the broader market segmentation and applications including Smartphone as he served as a leader for company-wide Smartphone project. He is currently a delegate for GTI (Global TD-LTE Initiative) from Taiyo Yuden and directly involved in several on-going 5G eMBB related projects within the organization. He also has deep understanding of MLCC (Multilayer Ceramic Capacitors) in terms of both technology and market trend.

(Key word: 5G, 6G, MLCC, RF, Front-end, WiFi, WLAN, WPAN, Connectivity, UWB, Cellular, Wireless technologies, PA, Filter, Duplexer, SAW, LTCC, BAW, FBAR, Smartphone, PC, Inductor, Module)


職歴

職歴:開示前

謝礼金額の目安

¥40,000 / 1時間

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